Intel’s Chris Auth says backside power changes the case for High-NA EUV versus TSMC

What was said

"We use backside power. That means that you actually alleviate some of the pitch requirements you have on the front side. That allows you to print that directly with High-NA. TSMC has to run tighter pitches because they don’t have backside power, and they can’t do that with High-NA, so they have to use double patterning EUV."

Chris Auth of Intel says Intel’s use of backside power relaxes certain front-side wiring pitch requirements, allowing some layers to be printed directly with High-NA EUV. He contrasts this with TSMC, saying that without backside power it faces tighter pitches and therefore needs double-patterning EUV, which in his view reduces the tool’s usefulness for TSMC.